"Hot melt molding" alternative to potting method and injection molding!
Molding at low temperature and low pressure allows for reduced damage to electronic components! Compared to conventional methods, productivity has significantly improved and contributes to cost reduction!
Our company conducts "hot melt molding," which injects low-melting-point thermoplastic resin into molds under low pressure to insert mold various electronic components, thereby adding diverse and excellent protective performance. Compared to conventional methods, this approach reduces damage to delicate electronic components while achieving increased productivity and lightweight, compact designs. Additionally, since the external shape can be directly molded, improvements in design aesthetics can also be expected. 【Features】 ■ Fast ■ Cost-effective ■ Considerate of both products and the environment *For more details, please download the PDF or feel free to contact us.
- Company：中谷産業
- Price：Other
